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会议日程
AGENDA
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开幕式 Opening Ceremony
09:00-09:30致辞讲话 Welcome Addresses
肖智轶 中国半导体行业协会封测分会当值理事长/中国半导体行业协会领导/工信部领导/昆山市领导/魏少军 清华大学教授,国际欧亚科学院院士,中国半导体行业协会副理事长09:30-09:50《中国半导体封测产业现状与展望》
Current Status and Outlook of China Semiconductor Packaging and Testing Industry
肖智轶 Zhiyi XIAO
中国半导体行业协会封测分会 当值理事长
Zhiyi XIAO, Rotating Chairman of China Semiconductor Industry Association, Packaging & Testing Branch09:50-10:10《第三代半导体的若干新进展》
Several New Advances in the Third Generation Semiconductor
郝 跃 Yue HAO
中国科学院院士、国家自然科学基金委员会信息科学部主任
Academician of Chinese Academy of Sciences09:00-10:10
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茶歇与展览交流 Networking Break
10:10-10:30
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主旨报告 Plenary talk
10:30-10:45《打造先进半导体智造大数据系统》
Building an Advanced Semiconductor Manufacturing Big Data System
刘志农 Zhinong LIU
紫光展锐(上海)科技有限公司 执行副总裁
EVP, Unisoc (Shanghai) Technologies Co., Ltd10:45-11:00《激光应用与半导体先进异质封装中的挑战》
Laser Application and Challenges in Semiconductor AdvancedHeterogeneous Packaging
何建锡 Desmond Hor
无锡先导集团 VP,无锡光导精密科技有限公司 副总经理
VP of Wuxi Lead Group, VGM of Wuxi Lead Laser Technology Co., Ltd.11:00-11:15《面向大算力高带宽应用领域的高可靠微系统集成技术》
High Reliability Microsystem Integration Technology for High Computing Power and High Bandwidth Applications
于宗光 博士 Zongguang YU
中科芯集成电路有限公司,电科集团首席科学家/中国半导体行业协会封测分会 轮值理事长
China Key System & Integrated Circuit Co., Ltd. Chief Scientist of CETC/Rotating Chairman, Packaging & Testing Branch of China Semiconductor Industry Association11:15-11:30《2.5D&3D先进封装刻蚀技术难点及解决方案》
2.5D&3D Advanced Packaging Etching Technology Challenges and Solutions
张伟涛 Weitao Zhang
北京北方华创微电子装备有限公司 第一刻蚀事业单元产品总监
Beijing NAURA Microelectronics Equipment Co., Ltd. The Product Director,BU ETCH I11:30-11:45《从芯片设计公司角度谈chiplet封装:改变传统规则的创新》
Chiplet Packaging in IC design: A Game-Changer
谷 雨 Ed Gu
沐曦集成电路(上海)有限公司 封装设计、芯片供应链总监
MetaX Integrated Circuits (Shanghai) Co., Ltd., Director, Package & Chip Supply Chain11:45-12:00《先进封装助力中国”芯”突破》
Advanced packaging will help China's chip makes significant breakthrough
马书英 Shuying Ma
华天科技 研究院院长
Dean of Huatian Science and Technology Research Institute12:00-12:15昆山市集成电路产业发展环境推介10:30-12:15
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自助午餐 Buffet Lunch
12:15-13:30
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主旨报告 Plenary talk
13:30-13:50《Chiplet 技术的现状,挑战和机遇》
Latest Developments, Challenges and Opportunities of Chiplet technologies
谢 鸿 Hong XIE
通富微电副总裁,工程技术中心总经理
TongFu Microelectronics VP, General Manager of the Corporate Engineering Center13:50-14:10《光学显微技术在半导体制造中的应用》
Application of Optical Microscopy in Semiconductor Manufacturing
马 骁 Xiao Ma
深圳市格灵精睿视觉有限公司 首席光学科学家
Shenzhen Glint Vision Co., Ltd14:10-14:30《先进扇出型封装的芯片整合趋势》
Chiplet integration trend in advanced Fan-out Packaging
王隆源 David Wang
矽品研发中心 处长
CRD, SPIL14:30-14:50《芯片-封装-电路板协同设计》
Chip-Package-PCB Co-Design
吴声誉 David Wu
上海弘快科技有限公司 董事长
CEO of Shanghai RedEDA Co., Ltd.14:50-15:10《AI视觉融合解决方案在缺陷检测中的应用》
AI-and-vision-fusion Solution and Application in Defect Inspection
丁新宇 Xinyu Ding
镁伽科技 首席技术官&半导体事业部总经理
MEGAROBO Technologies, Chief Technology Officer & General Manager of Semiconductor Business Unit15:10-15:30茶歇与交流 Networking Break15:30-15:50《汽车电子测试分选机的多元化最优成本解决方案》
Diversified cost-optimized solutions for automotive electronics test handler
林广满 Guangman Lin
深圳市深科达半导体科技有限公司 总经理
Shenzhen shenkeda Semiconductor Technology Co., Ltd General Manager15:50-16:10《先进测量技术助力芯片生产良率提升》
Advanced inspection & measurement technologies help improving the yield during chip manufacturing
吴昌力 Changli Wu
聚时科技(上海)有限公司 研发总监
Matrixtime Robotics Co.,Ltd. R&D Director16:10-16:30《干冰清洗技术介绍和应用案例》
Dry Ice Cleaning Technology Introduction and Case Studies
孙 刚 Steven Sun
酷捷干冰设备(上海)有限公司 中国区销售总监
Sales Director-China16:30-16:50《半导体划片制程及精密点胶工艺分享》
Semiconductor dicing process and precision dispensing process to share
周 云 Yun ZHOU
深圳市腾盛精密装备股份有限公司 精密切割事业部总监
Shenzhen Tensun Precision Equipment Co., Ltd.,Semiconductor Precision Dicing BU Director16:50-17:10《应用于智能计算的先进封装集成》
Adv. PKG Integration for Smart Computing Application
林耀剑 JCET Group, VP
长电科技 副总裁
江苏长电科技股份有限公司17:10-17:30《基于半导体3D堆叠技术的晶圆激光蚀刻方案》
Wafer Laser Etching Scheme Based on Semiconductor 3D Stacking Technology
陈 畅 博士 Chang CHEN
深圳市大族半导体装备科技有限公司 研发总监
Shenzhen Han’s Semiconductor Equipment & Technology Co., LTD17:30-17:50《先进封装技术创新实践与思考》
Practice and thinking of innovation of advanced packaging technology
于大全 博士 Daquan Yu
厦门云天半导体科技有限公司 总经理
CEO of Xiamen Sky semiconductor Co., Ltd.17:50-18:10《电子封装材料界面研究的新理论和新方法》
New Theory and New Method for the Interfacial Study of Electronic Packaging Materials
薛 奇 Gi Xue
南京大学
Nanjing University13:30-17:50
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欢迎晚宴 Welcome Dinner
18:00-20:00
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封装测试工艺设备的创新和机遇
09:00-09:25《磨划芯工艺,共创新未来》
Advanced Grinding Technology for A New Future
高金龙 Jinlong Gao
江苏京创先进电子科技有限公司 副总经理
JCA & Vice general manager09:25-09:50《HALT与电子产品的故障原因分析》
Failure Analysis of Electronics Products Subjected to HALT
吴建德 Walter Wu
ESPEC上海公司 QUALMARK HALT&HASS产品技术总监
HALT/HASS Applications Senior Engineer, ESPEC Environmental Equipment(Shanghai)Co.,LTD.09:50-10:15《异质异构集成与C2W混合键合设备进展》
Advances in Heterogenous Integration & C2W Hybrid Bonder
王 敕 Eric,Chi WANG
苏州艾科瑞思智能装备股份有限公司 董事长/创始人
SUZHOU ACCURACY ASSEMBLY AUTOMATION Co., Ltd Founder/Board Chairman09:00-10:15
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茶歇与交流 Networking Break
10:15-10:30
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封装测试工艺设备的创新和机遇
10:30-10:55《键合及解键合在封装领域的应用》
Applications of Bonding and Debonding in Semiconductor Package
张羽成 博士 Dr.YuCheng Zhang
苏州芯睿科技有限公司
SUZHOU IWISEETEC CO.,LTD10:55-11:20《雅马哈机器人控股有限公司关于功率器件银烧结工艺一站式解决方案及设备的介绍》
YAMAHA 1 STOP SMART SOLUTION for Sintering
李青达 Eric LEE
雅马哈机器人控股株式会社PFA 台北事务所 所长
Manager, Taiwan Office, PFA Corporation, YAMAHA Robotics Holding11:20-11:45《新能源车电池管理系统设备测试与趋势》
Battery Management Systems (BMS) Device Testing and Trends for Automotive
黄奕茂 Aik-Moh Ng
泰瑞达 产品与营销经理
Product Manager, Teradyne11:45-12:10《无助焊剂热压焊在超微间距凸块及大芯片领域的应用》
Fluxless TCB for Ultra-fine Pitch and Large Die Applications
赵 华 Eric Zhao
库力索法私人有限公司 中国区产品经理 先进封装事业部
Kulicke & Soffa Pte. Ltd., Regional Product Marketing Manager, Advance Packaging10:30-12:10
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自助午餐 Buffet Lunch
12:10-13:30
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封装测试工艺设备的创新和机遇
13:30-13:55《SMEE先进封装光刻机助力Chiplet技术发展》
SMEE Advanced Packaging Lithography Stepper Helps the Development of Chiplet Technology
黄栋梁 博士 Douglas Huang
上海微电子装备(集团)股份有限公司 副总经理
Vice GM of Shanghai Micro Electronics Equipment(Group) CO.,LTD13:55-14:20《存储芯片固晶设备的机遇与挑战》
Opportunities and Challenges for Memory Die Bonder
欧阳小龙 Xiaolong Ouyang
东莞触点智能装备有限公司 研究院副院长
Vice President, R&D Center of DongGuan Attach Point Intelligent Equipment Co.,Ltd14:20-14:45《基于先进封装的2.5D/3D异构集成技术研究》
Study of 2.5D/3D Heterogeneous Integration Based on Advanced Packaging
王成迁 Chengqian WANG
中科芯集成电路有限公司 微系统制造部副主任
Deputy Director of China Key System & Integrated Circuit CO., LTD, Micro-Manufacture Department14:45-15:10《基于微纳互连的异构集成微系统技术趋势与展望》
Trends and Prospects of Heterogeneous Integrated Microsystem Technology Based on Micro-Nano Interconnection
陈雷达 Leida CHEN
珠海天成先进半导体科技有限公司 副总经理
Vice General manager of Natural Integration Advanced Semiconductor Technology Co.,Ltd.13:30-15:10
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茶歇与交流 Networking Break
15:10-15:25
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封装测试工艺设备的创新和机遇
15:25-15:50题目待定
TBD
李 俊 Jun LI
天芯互联科技有限公司技术专家
Technical Expert of Sky Chip Interconnection Technology Co., Ltd.15:50-16:15《先进贴片设备:赋能后摩尔时代先进封装技术迭代与创新》
Advanced Die bonder Equipment: Empowering the Iteration and Innovation of Advanced Packaging Technology in the Post Moore Era
宋 涛 Jason SONG
华封科技 副总经理
Vice president of Capcon Limited16:15-16:55《ISO26262 车辆功能安全体系在汽车电子行业中的应用》
Application of ISO26262 Vehicle Functional Safety System in the Automotive Electronics Industry
张宗伟 Zongwei ZHANG
必维国际集团 大中华区功能安全负责人
Head, Functional Safety Certification, Bureau Veritas China15:25-16:55
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封装关键材料的创新与合作
09:00-09:25《先进封装基板的机会与挑战》
The opportunities and challenges of Advanced Packaging substrate
谷 新 Xin GU
中山芯承半导体有限公司总经理
CEO of Zhongshan CCSC Co., LTD09:25-09:50《固化动力学在环氧塑封料上的应用》
Application of Curing Kinetics in Epoxy Molding Compound
刘 香 Xiang LIU
上海道宜半导体材料有限公司 研发经理
刘 香 上海道宜半导体材料有限公司 研发经理09:50-10:15《半导体引线框架铜合金的新进展》
New Progress in Copper Alloys for Semiconductor Lead Frames
张 敏 Jason Zhang
博威合金板带技术市场部 总监
Director, Technical Marketing Department of Boway Alloy Plate and Strip Co., Ltd09:00-10:15
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茶歇与交流 Networking Break
10:15-10:30
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封装关键材料的创新与合作
10:30-10:55《先进封装材料解决方案,助力可持续发展》
Advanced Packaging Material Solutions Empowering Sustainable Development
张 靖 博士 Jing Zhang
贺利氏电子中国研发总监
Head of Shanghai Innovation Center, Heraeus Electronics China10:55-11:20《感光聚酰亚胺材料在国内的开发现状与展望》
Current Development Status and Outlook of PhotoSensitive Polyimide Materials (PSPI) in Domestic Market
崔庆洲 Qingzhou Cui
济南圣泉新材料有限公司 电子材料事业部 光刻胶研发总监
R&D Director for Photoresist Materials, Jinan Shengquan New Materials LTD.11:20-11:45《中科科化环氧塑封料产品研究进展》
Research Progress of Epoxy Molding Compound in Zhongke KEHUA
王善学 Sanxue Wang
江苏中科科化新材料股份有限公司 副总经理
Dupty Gerneral Manager, Jiangsu Zhongke KEHUA New Materials Co., Ltd10:30-11:45
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自助午餐 Buffet Lunch
12:00-13:30
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封装关键材料的创新与合作
13:30-13:55《新阶段先进封装材料的挑战及其解决方案》
The Challenge and Solution for Advanced Package Material
张建东 Tommy Zhang
韦尔通科技股份有限公司 半导体业务技术支持总监
Weldtone Technology Co., Ltd. Technical Service Director13:55-14:20《新型焊接热界面材料在先进封装中的应用》
Application of New Soldering Thermal Interface Materials in Advanced Packages
胡彦杰 Leo HU
铟泰公司 华东区高级技术经理
Indium Corporation,Senior Area Technical Manager - East China14:20-14:45《越亚先进封装载板解决方案》
ACCESS Advanced IC-Substrate Solutions
陈先明 Simon CHAN
珠海越亚半导体股份有限公司 CEO
CEO of Zhuhai ACCESS Semiconductor Co., Ltd.14:45-15:10《介绍Cluster材料科技有限公司生产的半导体相关封装材料》
Introduction of semiconductor assembly material from Cluster Technology Co., Ltd.
道白 浩太郎 Douhaku Kotaro
Cluster 材料科技有限公司
Cluster Technology Co., Ltd.13:30-15:10
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茶歇与展览交流 Networking Break
15:10-15:25
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封装关键材料的创新与合作
15:25-15:50《功率半导体封装浆料解决方案》
Power Semiconductor Packaging Paste Solutions
王彦滕 Norman WANG
无锡湃泰电子材料科技有限公司 销售总监
PacTite Electronic Materials Co., Ltd. Chief Sales Officer15:50-16:15《高可靠性QFN封装引线框架解决方案》
High reliability QFN packaging lead frame solution
章新立 Sidney.Zhang
Ningbo Kangqiang Electronics Co.,Ltd. Deputy General Manager of ELF Division
宁波康强电子股份有限公司 ELF事业部副总经理16:15-16:40《浅淡国产环氧塑封料的技术发展》
Technical Development of Domestic Epoxy Molding Compound
谭 伟 Wei Tan
江苏华海诚科新材料股份有限公司 研发部长
R&D Manager of Jingsu HHCK Advanced Materials Co., Ltd16:40-17:05《碳化硅模组封装新材料解决方案》
New material solutions for silicon carbide module packaging
陈明涵 Sean Chen
苏州住友电木有限公司 市场与销售 副部长
Deputy Senior Manager, Marketing & Sales of Sumitomo Bakelite (Suzhou) Co., Ltd.15:25-17:05
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汽车电子芯片及功率化合物半导体封装测试技术
09:00-09:25《车载产品封测控制》
Technology and Quality control for Automotive Electronic Packaging
郭小伟 Xiaowei Guo
华天科技(西安)有限公司 技术总监
Technical Director of Huatian Technology Xi’an Co., Ltd09:25-09:50《国产智造软件,助力半导体封测工厂数智化升级》
Domestic intelligent manufacturing software to assist in the digital and intelligent upgrading of semiconductor packaging and testing factories
马 巍 Wayne
格创东智半导体事业部 副总经理
Vice-general Manager, Semiconductor BG09:50-10:15《蔡司显微镜助力先进封装失效分析和工艺优化》
ZEISS microscopy solutions for advanced packaging failure analysis and process optimization
黄承梁 Chengliang Huang
卡尔蔡司(上海)管理有限公司 业务拓展经理
Carl Zeiss (Shanghai) Co.,Ltd., BD Manager09:00-10:15
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茶歇与展览交流 Networking Break
10:15-10:30
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汽车电子芯片及功率化合物半导体封装测试技术
10:30-10:55《功率半导体发展趋势以及爱德万测试CREA 平台测试解决方案介绍》
Power semiconductor trends and test solutions of Advantest CREA
王俊林 Junlin Wang
Advantest China, Business Development & Center of Expertise,Asia
爱德万测试(中国)业务发展部 资深技术专家10:55-11:20《碳化硅功率模块关键封装技术》
Key Packaging Technologies for Silicon Carbide Power Module
孙炎权 Jet SUN
基本半导体(无锡)有限公司 技术总监
Director, Basic Semiconductor (Wuxi)Co., Ltd11:20-11:45《碳化硅功率器件测试:从研发到量产、从晶圆到应用》
Silicon Carbide Power Device Testing: from Development to Mass Production, from Wafer to Application
高 远 Yuan GAO
泰科天润半导体科技(北京)有限公司 应用测试中心总监
Global Power Technology Co., Ltd., Inc., Director of Application and Test Center11:45-12:10《特色封装设计与工艺技术》
Characteristic package design and technology
王 珏 Jue Wang
四川遂宁市利普芯微电子有限公司 市场研发部经理
Sichuan Suining Lippxin Microelectronics CO.,LTD Marketing & RD manager10:30-12:10
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自助午餐 Buffet Lunch
12:10-13:30
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先进封装和测试技术
13:30-13:55《先进封装在汽车领域的应用及发展趋势》
Application and Development Trends of Advanced Packaging in the Automotive Industry
张军锋 Johnson Zhang
长电科技汽车电子事业部 总监
JCET Auto BU, Director13:55-14:20《先进封装制程发展及气泡解决方案》
Development of Advanced Packaging Process and Solution to Bubble Problem
张景南 Woody Jones
南京屹立芯创半导体科技有限公司 总经理
General Manager, Elead Technology Co., Ltd.14:20-14:45《半导体先进封装测试 智能制造CIM管理方案 (WLCSP、2.5D、3D、SiP多芯片键合、Bumping、RDL)》
CIM Solution in Semiconductor Packing、Test & Assembly Service
古惠瑜 Anita.Gu
南京鼎华智能系统有限公司半导体事业处 产品研发 总监
Product Development Director of Semiconductor Division of anjing DigiHua Intelligent Systems Co.,Ltd.14:45-15:10《汽车半导体封装-市场与技术动态》
Automotive Semiconductor Packaging – Market & Technology Dynamics
李健民 Jianmin LI
安靠封装测试(上海)有限公司 研发总监
Packaging RnD Director, Amkor Assembly & Test (Shanghai) co. Ltd.13:30-15:10
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茶歇与展览交流
15:10-15:25
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先进封装和测试技术
15:25-15:50《助力先进封装技术研发及良率提升--赛默飞失效分析方案介绍》
ThermoFisher Scientific Solution for Advanced Packaging R&D and Failure Analysis
杨维新 Vincent Yang
赛默飞世尔科技 商务拓展经理
ThermoFisher Scientific, Sales Development Manager15:50-16:15《超越摩尔:小芯片及先进异构集成》
Beyond Moore: Chiplets and Advanced Heterogeneous Integration
吴政达 博士 Cheng-Tar Terry Wu
韩国三星电子 先进封装事业部 总监
Director, Business Development Team, AVP, Samsung Electronics16:15-16:40《集成电路封装之异构集成技术进展》
Development of IC Heterogeneous Integration Packaging Technology
姚大平 Daping YAO
江苏中科智芯集成科技有限公司,董事长、总经理
Jiangsu CAS Microelectronics Integration Technology Co16:40-17:05《摩尔精英SiP解决方案》
摩尔精英15:25-17:05
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专题五:企业专场
12:00-13:30午餐、注册13:30-13:45开幕致辞13:45-14:15汉高汽车半导体材料解决方案14:15-14:45汉高高导热芯片粘接解决方案14:45-15:15汉高面向先进封装应用的材料解决方案15:15-15:45茶歇15:45-16:15汉高芯片粘接膜解决方案16:15-17:00交流及纪念品资料领取13:30-17:00
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封测方案
PACKAGE TEST SOLUTION
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以太网芯片的测试挑战与解决方案
- 华天科技研究院院长马书英博士以《后摩尔时代先进封装的机遇和挑战》为题,针对先进封装发展历程、华天科技三维晶圆级封装平台、先进封装面临的机遇和挑战,进行精彩的分享.....更多
后摩尔时代先进封装的机遇和挑战
- 合肥矽迈微电子科技有限公司总经理谭小春以《基板扇出型封装工艺及应用》为题,分享了扇出型封装结构的特点和优势、扇出型封装面临的机遇和挑战、合肥矽迈扇出型方面应用案.....更多
基板扇出型封装工艺及应用
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