iTGV 2027 will drive glass substrates toward AI chips.

iTGV 2027 will drive glass substrates toward the mass production of first‑generation AI chips.

The 4th International Through‑Glass‑Via Technology Innovation and Application Forum (iTGV2027) will take place from May 12‑14, 2027 at Wuxi International Conference Center, Jiangsu, China. It is jointly organized by the Institute of Microelectronics of Chinese Academy of Sciences, Future Semiconductor and IEEE Electronics Packaging Society (IEEE‑EPS).

Under the theme “Leaping Across the Chasm, Bridging the Future”, iTGV2027 focuses on glass‑substrate deployment for AI large‑chip packaging. It covers core technical areas including Through‑Glass‑Via (TGV), glass interposer, glass interconnect bridge, ultra‑high‑aspect‑ratio stacked glass circuit boards and panel‑level packaging. The forum aims to accelerate large‑scale mass production and industrial implementation of glass‑substrate technologies.

iTGV 2027  International Through Glass Via Technology Innovation and Application Forum consists of one main forum plus nine sub‑forums, covering GCP glass circuit board, CoPoS, FOPLP fan‑out panel‑level packaging, iCPO co‑packaged optics, Glass‑CoWoS, Micro‑LED‑CPO, and glass‑substrate applications for automotive, robotics and satellites. In total, 120 technical presentations will be delivered, addressing glass‑substrate roadmap adjustment, advanced‑packaging material innovation and co‑packaged optics. It is projected to attract more than 7,000 industry experts and corporate delegates globally.

Launched in November 2024, iTGV has already held three successful editions. It is the world’s key commercial event dedicated to pushing glass‑substrate technology from pilot‑line validation toward mass manufacturing for artificial‑intelligence scenarios. Past keynote speakers include specialists from Huawei HiSilicon, ZTE Microelectronics, and Georgia Institute of Technology (one of the inventors of glass‑substrate technology).

For reference, iTGV2026 gathered 200 exhibitors and 6,500 registered attendees, running alongside the CSPT iTGV semiconductor packaging‑test & glass‑substrate ecosystem exhibition. A wide range of well‑known enterprises across advanced packaging, equipment and material supply chains participated as supporting partners. For booth and speaking‑slot reservations, you may contact Master Qi to ：xinguang.qi@fsemi.tech.

iTGV 2027：The 4rd International Through Glass Via Technology Innovation and Application Forum
Time：2026.5.12-14
Palce：Wuxi International Conference Center（Jiangsu China）
Organizer：IMECAS、IEEE EPS China、Future Semiconductor
Official website: [https://www.itgv.org